Co-Editors in Chief
Chih Ping TSO
Multimedia University, Melaka, Malaysia
Multimedia University, Melaka, Malaysia
Editors
Bin Xiao
Texas State University, San Marcos, TX, USA
Texas State University, San Marcos, TX, USA
University of Florida, Gainesville, USA
Adrian BejanDuke University, Durham, USA
Anju R. Gupta
University of Toledo, Toledo, USA
Dunxi Yu
Huazhong University of Science and Technology, Wuhan, China
Xiaofeng Xiang
Siemens Digital Industries Software, USA
Büryan Apaçoğlu-Turan
Simularge A.S., Istanbul, Turkey
Huan Xi
Xi'an Jiaotong University, Xi'an, China
Yanli Zhu
Beijing Institute of Technology, Beijing, China
Xueqiang Shi
North University of China, Taiyuan, China
Yong Lu
Beijing University of Chemical Technology, Beijing, China
Anirban Chattopadhyay
Government General Degree College Ranibandh, Bankura, W.B. India
Siemens Digital Industries Software, USA
Büryan Apaçoğlu-Turan
Simularge A.S., Istanbul, Turkey
Huan Xi
Xi'an Jiaotong University, Xi'an, China
Yanli Zhu
Beijing Institute of Technology, Beijing, China
Xueqiang Shi
North University of China, Taiyuan, China
Yong Lu
Beijing University of Chemical Technology, Beijing, China
Anirban Chattopadhyay
Government General Degree College Ranibandh, Bankura, W.B. India
Weiguang Su
Qilu University of Technology, Jinan, China
Qilu University of Technology, Jinan, China
Mohamed Bechir BEN HAMIDA
Imam Mohammad Ibn Saud Islamic University, Riyadh, Saudi Arabia
Imam Mohammad Ibn Saud Islamic University, Riyadh, Saudi Arabia
Mahyar Kargaran
Islamic Azad University, Mashhad Branch, Iran
Islamic Azad University, Mashhad Branch, Iran
Dadamiah PMD Shaik
Vardhaman College of Engineering, Hyderabad, India
Lvping Fu
Wuhan University of Science and Technology, Wuhan, China
Chenzhen Liu
Hebei University of Technology, Tianjin, China
Vardhaman College of Engineering, Hyderabad, India
Lvping Fu
Wuhan University of Science and Technology, Wuhan, China
Chenzhen Liu
Hebei University of Technology, Tianjin, China
Fushou Xie
Xi’an Jiaotong University, Xi'an, China
Xi’an Jiaotong University, Xi'an, China
Wenhao Liang
The Hong Kong Polytechnic University, Hong Kong
S. Hemavathi
Central Electrochemical Research Institute, Chennai, India
The Hong Kong Polytechnic University, Hong Kong
S. Hemavathi
Central Electrochemical Research Institute, Chennai, India
Vinh Vo
IEEE Corporate Headquarters, New York, USA
Xiangjun Liu
Donghua University, Shanghai, China
Behzad Baghapour
Amirkabir University of Technology, Tehran, Iran
Biao Wang
Soochow University, Suzhou, China
Fatma Oflaz
Firat University, Elazig, Turkey
Taha Selim Ustun
Fukushima Renewable Energy Institute, Fukushima, Japan
IEEE Corporate Headquarters, New York, USA
Xiangjun Liu
Donghua University, Shanghai, China
Behzad Baghapour
Amirkabir University of Technology, Tehran, Iran
Biao Wang
Soochow University, Suzhou, China
Fatma Oflaz
Firat University, Elazig, Turkey
Taha Selim Ustun
Fukushima Renewable Energy Institute, Fukushima, Japan
Aixiang Ding
University of Illinois at Chicago, Chicago, IL, USA
University of Illinois at Chicago, Chicago, IL, USA
Krishan Chand
Vanderbilt University, Nashville, Tennessee, USA
Vanderbilt University, Nashville, Tennessee, USA
Osama Nsaif
Marquette University, Milwaukee, WI, USA
Marquette University, Milwaukee, WI, USA
Andaç Batur Çolak
Niğde Ömer Halisdemir University, Niğde, Türkiye
Niğde Ömer Halisdemir University, Niğde, Türkiye
Akash Kadam
Servotech Inc, Chicago, IL, USA
Walter Yuen
University of California, Santa Barbara, California, USA
Sharu B. Kandy
National Institute of Technology Calicut, Calicut, India
Servotech Inc, Chicago, IL, USA
Walter Yuen
University of California, Santa Barbara, California, USA
Sharu B. Kandy
National Institute of Technology Calicut, Calicut, India